It will be installed alongside PragmatIC’s existing pilot production line.
“This takes our collaboration to the next stage by supporting the development of their FlexLogIC system for high volume production,” said CPI director of printable electronics John Cocker.
FlexLogIC is a self-contained automated system for high throughput manufacturing of flexible plastic semiconductor devices, intended for mass-market applications, including labels, packaging, consumer goods, toys and games.
“Flexible electronic devices have opened up new applications that were previously not possible with conventional silicon chips, but the benefits can only be realised if they achieve the right cost point and scalable capacity needed for billions of circuits and beyond,” said PragmatIC CEO Scott White. “These agreements mark a major milestone in PragmatIC’s ambition to make smart objects truly viable in consumer markets.”
Equipment orders have been placed, and initial deliveries are already on site. The system will be commissioned through 2017 ready for volume production in early 2018.
PragmatIC’s Scott White will present an update on FlexLogIC at IDTechEx in Berlin this week.