Technology, Speed and Reliability are critical to the success in the electronic industries. We are well equipped with state-of-the-art technologically advanced automated SMT manufacturing line to deliver Technology, Speed and Reliability. Our manufacturing capability covers the wide spectrum of electronic manufacturing and diverse requirements of OEMs. We are flexible in volume, assembly and processes to support today’s complexity in manufacturing. To know more about plant and equipment, please visit  INFRASTRUCTURE page.

PCB assembly and Turnkey manufacturing are the core offerings from Trylene. Our capability includes

• Surface Mount (SMT) PCB Assembly
• Through Hole PCB Assembly
• Mixed or Complex SMT and Through Hole PCB Assembly
• PBGA (Pitch Ball Grid Array), FBGA (Fine Ball Grid Array), Micro-BGA, CSP, Ultra-fine pitch QFP and QFN
• Fine Pitch (0201 and 01005) components
• Thick/Thin Film
• Through Hole to SMT conversion
• High-Mix and Low-Medium Volume
• Conformal Coating & Epoxy Potting
• Rapid Prototyping
• Turnkey Manufacturing
• Box Build/Final assembly
• Wire and Cable Harnessing
• Board Level or System Level Testing
• Online Quality Control
• Lead Free, RoHS Compliant  and Non-RoHS Process